AMD Ryzen 7000s need less thermal paste

night has been the first expert company in cooling systems that has announced to reveal the first details about the cooling of the processors AMD Ryzen 7000. Interestingly, the information is limited to telling us the amount of thermal paste (or thermal compound) that we must use in these new processors. Of course, the information came from the hands of the leaker @momomo_us, and it is simply the instruction manual for use. This has been updated to add to the recently announced Ryzen 7000 processors.

Remember that the current air and water cooling systems for the AM4 socket are fully compatible with the new socket AM5but there are differences regarding the amount of thermal paste that you should put due to the curious design of the IHS (encapsulated) in the form of “octopus”.

With the AMD Ryzen 7000 we went from five points of thermal paste to one

This amount is summarized to put a single point of thermal compound in the center of the CPU covering between 3 to 4 mm to cover the entire IHS once the cooling system is in place. Yes, 3 or 4 mm, we are not mathematicians now, so leave it at a size slightly similar to of a grain of rice right in the middle of the CPU.

Until today, Noctua recommended five points of thermal compound in AMD processors to spread the thermal paste throughout the CPU encapsulation for its perfect dissipation. These were divided into one in each corner of the IHS and a fair one in the middlebut now everything is limited to one in the center. In truth, this was always the most popular method among users, although there were also many variants such as making an “X” of thermal paste. What’s more, for Intel processors the company has always recommended the grain of rice method.

The AM5 design and its socket, as well as its retention system make the difference

AM5 socket AMD 1

One of the differences for this change in Noctua’s recommendation is that the AM5 CPU is slightly smaller compared to an AM4 CPU. To this we must add the strange octopus-shaped design of the IHS, so it would also be a serious problem to use a thermal compound conductor of electricity and that it slips through one of the “legs” of the CPU. This will imply, directly, the instant death of the processor without the possibility of claiming its guarantee.

It is also implied that the legs also do not need to have thermal compound. It will be curious to see some future temperature test to find out if a single point of thermal paste is the ideal solution, or if there is any change in taking care to cover the legs also to improve heat transfer, and it is that it is necessary to remember that the increase power of these processors is also linked to a increased energy consumption.

So the TDP of high performance CPUs is 170Wwith a maximum consumption of up to 230W. A good thermal compound will help reduce to the minimum degree.

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